The trademark application BOND CONNECTOR TECHNOLOGY was filed by Henkel AG & Co. KGaA, a corporation established under the laws of the Federal Republic of Germany (the "Applicant"). The application was published for oppositions on February 9, 2016, and it was registered by office on May 18, 2016 without any oppositions.
It was designated 'Basic Application' for International Application 1305292 at the World Intellectual Property Organization (WIPO).
The application was filed in German (English was selected as the second language).
International trade mark of the trademark registration was recorded on August 17, 2016.