EUTM file information



November 21, 2014

Trademark Summary

The trademark application BOND BUFFER was filed by Danfoss Silicon Power GmbH, a corporation established under the laws of the Federal Republic of Germany (the "Applicant"). The application was published for oppositions on January 12, 2015, and it was registered by office on April 21, 2015 without any oppositions.

The application was filed in Danish (English was selected as the second language).

Goods And Services

  • The mark was filed in class 9 with following description of goods:
    1. Electronic components, namely power modules for controlling and switching high current
    2. Chips [integrated circuits]
    3. Semiconductor components for switching high current.